• Pin Fin Design: Maximize cooling of RAM Modules by improving heat dissipation. Help to eliminate system crashes due to over-clocking thermal issues.
  • Forged Processing: Unique manufacturing process creates very dense thermal material as opposed to traditional heat spreaders. Also the heatspreads are TWICE the thickness compared to others. This results in extremely efficient heat dissipation.
  • Efficient, User friendly design: Quick, easy installation process fits almost all motherboards and is compatible with all standard SDR/DDR/DDR2 & SDRM products.
  • Reduced operating temperature will not only help avoid system crashes but will also increase reliability, stability and longevity of your RAM modules.

Dimensions (mm)
132mm(L) x 26mm(W)x 1.5mm(T)
Pure Forged Copper

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