- Pin Fin Design: Maximize cooling of RAM Modules by improving heat dissipation. Help to eliminate system
crashes due to over-clocking thermal issues.
- Forged Processing: Unique manufacturing process creates very dense thermal material as opposed to
traditional heat spreaders. Also the heatspreads are TWICE the thickness compared to others. This results in extremely efficient
heat dissipation.
- Efficient, User friendly design: Quick, easy installation process fits almost all motherboards and is
compatible with all standard SDR/DDR/DDR2 & SDRM products.
- Reduced operating temperature will not only help avoid system crashes but will also increase reliability,
stability and longevity of your RAM modules.
 
Dimensions (mm)
|
132mm(L) x 26mm(W)x 1.5mm(T) |
Material
|
Pure Forged Copper |
Weight
|
30g |
|
